Polymer Circuits for Sensors
GDSI designs and manufactures polymer thick film circuitry for sensing devices with its proprietary Double Sided Polymer Circuitry D/SPC® technology. It eliminates the failure points of cross-over or jumper circuits. GDSI’s unique ability to print circuitry on both sides of a substrate and connect them through vias, eliminates the need for a screen printed dielectric to separate circuit traces. It also allows designers to reduce the circuitry foot print and lower overall resistance. D/SPC® circuitry is a much more cost effective solution than copper circuitry.
GDSI’s unique capabilities are ideal for certain sensing devises, specifically devices needing circuits that are flexible, reliable and have a higher density level than typical polymer thick film circuits. Specifically GDSI has the following capability:
- D/SPC® technology that allows printing on both sides of substrate, eliminating dielectric failure points
- Pin registration allowing tight cutline registration tolerances
- Screen printing in cleanrooms
- 100% electrical testing
- High volume fabrication capability
GDSI has the ability to work with and support customers from the design and development stages all the way through high volume production. GDSI has full CAD capabilities to maximize value and bring any concept into a cost effective design to meet or exceed the customer’s specifications.